Packaging Engineer - Inductor and Power Module

Change the world. Love your job.

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities may include:

• Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
• Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
• Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
• The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to-market targets.