Process Development Engineer - Packaging

InLighten Technologies is a Silicon Valley company developing next-generation micro

LED technologies for augmented reality (AR) and AI-powered smart glasses. Our mission is to push the limits of micro

LED performance and manufacturing, enabling scalable, mass-market production. Join us to help create the displays that will power the future of immersive computing.

We are seeking a Process Development Engineer - Packaging, to support the development and mass production of micro

LED AR light engines. This role will focus on advanced packaging processes, including die bonding, interconnection, optical integration, and reliability, working closely with device, optics, and system teams to transition technologies from R&D to volume manufacturing.

• Develop, optimize, and qualify packaging processes for micro
  
  LED AR light engines.
• Micro
  
  LED die bonding with FPC/PCB
• Interconnect technologies
• Wafer-level or panel-level packaging
• Optical component integration (wave guides, collimators, micro-optics, etc.)
• Define process flows, DOEs, and control plans for new packaging technologies
• Drive yield improvement, defect reduction, and cost optimization
• Support EVT / DVT / PVT builds and ramp to mass production
• Perform failure analysis and root cause investigations related to packaging and assembly
• Collaborate with device, optics, system, equipment, and manufacturing teams
• Work with equipment vendors, and material suppliers
• Generate and maintain process documentation, specifications, and qualification reports

• Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field
• 3-7 years of experience in advanced packaging or process development
• Strong understanding of semiconductor and optoelectronic packaging processes
• Hands‑on experience with die attach, bonding, interconnect, and assembly processes
• Experience running DOE, process characterization, and data analysis
• Familiarity with yield, reliability, and manufacturing metrics
• Ability to work in a cross-functional, fast-paced R&D-to-production environment
• Ability and willingness to travel internationally up to 20%

• Advanced degree (MS or PhD) in a relevant field of study.
• Direct experience with micro
  
  LED, LED, or CIS packaging
• Experience in AR light engines or optical module packaging
• Familiarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)
• Hands‑on experience with process yields analysis and defect characterization
• Salary Range: $104k - $208k/year
• Comprehensive health, dental, and vision insurance.
• Paid holidays and vacation
• Employee stock option plan

InLighten Technologies is an equal opportunity employer that is committed to inclusion and diversity. We promote equal opportunity for all applicants without regard to race, color, religion, sex, gender identity, sexual orientation, national origin, disability, veteran status, or any other legally protected characteristics.