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Advanced Packaging Engineer 5D/3D Chiplets AI
Job in
Santa Clara, Santa Clara County, California, 95053, USA
Listed on 2026-05-09
Listing for:
Tenstorrent Inc.
Full Time
position Listed on 2026-05-09
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
Tenstorrent Inc. is looking for an Advanced Packaging Process Engineer to join their team in Santa Clara, CA. In this hybrid role, you will drive the implementation of advanced package technology for next-generation AI/ML products. The position requires a strong background in 2.5D/3D chiplet packaging and reliability analysis, as well as over 5 years of experience in advanced packaging engineering.
Compensation ranges from $100k to $500k, depending on experience, skills, and education.
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