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5D​/3D Chiplet Packaging Engineer

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: Tenstorrent
Full Time position
Listed on 2026-05-09
Job specializations:
  • Engineering
    Packaging Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 100000 USD Yearly USD 100000.00 YEAR
Job Description & How to Apply Below
Position: 2.5D/3D Chiplet Packaging Engineer
Tenstorrent is looking for an Advanced Packaging Process Engineer to join our team in Santa Clara, CA. In this hybrid role, you will be responsible for driving advanced packaging technology for next-generation AI/ML products, collaborating closely with foundries and OSATs. Candidates should have a strong background in 2.5D/3D packaging processes, reliability analysis, and a relevant advanced degree. We offer a competitive compensation package ranging from $100k to $500k, and we are committed to fostering an inclusive work environment.
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