MEMS Integration Engineer

nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye's MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's Super Switch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.

Job Overview

We are seeking a highly technical MEMS Integration Engineer to bridge the gap between our internal design engineering teams and external foundry partners.

This role requires a strong foundry process engineering background combined with the strategic oversight of a foundry manager. You will be responsible for owning the technical execution of product development, driving new product introduction (NPI), and ensuring the successful transfer of our Silicon Photonics and MEMS processes to high-volume manufacturing.

Your success will ensure seamless integration and alignment with nEye's device specifications, optimizing device performance, reducing unit costs, and maximizing wafer yield through continuous improvement.

Key Responsibilities

• Product Development & Transfer: (1)
  Partner closely with design engineering and fabs to define, develop, and refine process flows for new MEMS products. (2) Oversee the end-to-end NPI lifecycle, from process transfer to external foundries, ensuring manufacturability and repeatability. (3) Act as the primary technical interface between nEye's design team and foundry integration engineers.
• Foundry Process Engineering: (1) Design, document, and execute end-to-end MEMS process flows. You will integrate diverse modules (lithography, etch, thin films) into a cohesive fabrication sequence. (2) Develop and maintain rigorous process specifications, utilizing deep expertise in diverse fabrication modules including lithography, etch, and deposition to ensure seamless integration. (3) Wafer Bonding Implementation:
  Act as the Subject Matter Expert (SME) for back-end bonding technologies, including: anodic, fusion, eutectic, and hybrid bonding to achieve long-term hermeticity;
  Surface preparation and activation (plasma/chemical);
  Management of Thermal Expansion (CTE) mismatch and bond-induced stress. (4) TSV & 3D Integration:
  Lead the development and integration of Through-Silicon Vias (TSVs) for advanced device packaging. (5) Manage Foundry Tape-out activities, ensuring successful execution and alignment with project timelines. (6) Own the technical execution of the fabrication schedule, foundry activities and deliverables to ensure on-time wafer out. (7) Monitor Statistical Process Control (SPC) and address Out of Control (OOC) events immediately.
• Yield & Failure Analysis: (1) Analyze metrology data (SEM, AFM, C-SAM, IR, profilometry) to identify failure modes in the bond interface (e.g., voids, delamination) and implement corrective actions. (2) Track, analyze, and report on key process and device performance metrics, identifying opportunities for performance uplift and process simplification. (3) Lead Root Cause Analysis (RCA) and 8D reporting for process deviations or hardware failures, working closely with foundry FA labs.
  
  (4) Drive Continuous Improvement Plans (CIP) to optimize device performance, reduce unit costs, and maximize wafer yield.

Required Experience

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, MEMS, Applied Physics, Materials Science, or a related technical field.
• 5+ years of hands-on experience in foundry process engineering, MEMS, or CMOS process development and integration.
• Product
  
  Experience:
  
  Proven track record managing tape-outs and taking products through the NPI lifecycle into high-volume manufacturing within a foundry environment.
• Process Architecture:
  Proven track record of architecting and executing successful, end-to-end MEMS process flows. Must demonstrate the ability to balance thermal budgets and material compatibility across complex modules.
• Advanced Wafer Bonding:
  Deep expertise in Wafer-to-Wafer (W2W) integration, including surface activation,…