Package Design Engineer - level

Position: Package Design Engineer - Up to Staff level
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Company:

Qualcomm Technologies, Inc.

## Job Area:

Engineering Group, Engineering Group Packaging Engineering

General

Summary:

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

Role and Responsibilities:

* Own and drive advanced package selection, new generation product package structure, and configuration optimization.

* Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.

* Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.

* Implement the physical design of packages and modules for SoC.

* Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.

* Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.

* Work multi-functionally to optimize package pin out.

* Ensure package design is optimized with SI/PI requirements.

* Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.

* Explore, evaluate, and develop new CAD tools, design, and verification flow.

* Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.

Skills:

As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:

* Proficient in Cadence APD & SiP.

* Basic knowledge in high-speed IO interfaces and electromagnetic field.

* Knowledge of IC packaging structures, chip-package, and package-board interaction.

* Basic knowledge of electronic packaging process and typical failure modes preferred.

Preferred Qualifications:

* Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.

* Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.

* Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).

* Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).

* Basic understanding of some SI/PI tools (Xtract

IM, Power

SI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.

* Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.

* Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.

* Experience with Calibre tool and package design reviews.

* Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).

* Solid understanding of Design Rules Check and Design for Manufacturing.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.

Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies:
Our Careers Site is only for individuals seeking a job ffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location.

Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO

Employer:

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$ - $

The above pay scale reflects the broad, minimum to…