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Manufacturing Process Engineer III

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: FUJIFILM Dimatix, Inc
Full Time position
Listed on 2026-06-17
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 135000 - 165000 USD Yearly USD 135000.00 165000.00 YEAR
Job Description & How to Apply Below

Job Description

Salary range for position: $135,000 - $165,000, commensurate with experience.

POSITION SUMMARY:

Develop and improve wafer fab MEMS processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems.

Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Knowledge: Having ranging experience, uses professional concepts and company objectives to resolve complex issues in creative and effective ways.

Job Complexity: Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results. Internal and external contacts often pertain to company plans and objectives.

Supervision: Determines methods and procedures on new assignments and may coordinate activities of other personnel (Team Lead). Be able to work self-directed.

Experience: Typically requires a minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a Master’s degree’ or PhD with 3 years' experience; or equivalent work experience.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Develop and improve wafer fab processes working on a variety of MEMS process engineering disciplines (Photolithography, Wet Etch, Thin Films, Sputtering, PECVD, Laser Dice, Ash and Wet Strip, Bond, CMP, Dry Film, AOI, Automation Systems, FDC...)
  • Use and run wafer metrology tools to analyze problems, failures and other technical issues.
  • Use good problem solving and project management skills to solve the wide array of technical product problems.
  • Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
  • Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
  • Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

SUPERVISORY RESPONSIBILITIES:

None

QUALIFICATIONS:

  • Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
  • Must have related experience in semiconductor, MEMS manufacturing...
  • Ability to find root causes of wafer fab problems.
  • Excellent problem identification and problem-solving skills.
  • Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
  • Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
  • Ability to respond to common inquiries or complaints from internal resources and customers.
  • Ability to carry out data analysis using JMP, Minitab. Green or Black Belt preferably.
  • Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

PHYSICAL DEMANDS:

  • Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
  • Sitting one-third to two-thirds of the time.

WORK ENVIRONMENT:

Works in wafer fabrication and clean room environment. Exposure to moderate noise levels. May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated.

Employees will ensure that waste containers are closed after transferring waste to them. Report any incidents involving…

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