Senior Mechanical Application Development Engineer

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is
a world leader in interconnect solutions for Communications, Mobile, RF, Optics,
and Commercial electronics markets. Amphenol Corporation is one of the world's
largest designers and manufacturers of electrical, electronic and fiber optic
connectors and interconnect systems, antennas, sensors, sensor-based products
and coaxial and high-speed specialty cable. ACS has an expansive global presence
in research and development, manufacturing, and sales. We design and manufacture
a wide range of innovative connectors as well as cable assemblies for diverse
applications, including server, storage, data center, mobile, RF, networking,
industrial, business equipment, and automotive.

Position:
Senior Mechanical Application Development Engineer - HSIO
Connectivity and Thermal Solutions

Location:

Santa Clara, CA

Position Overview

Amphenol High Speed Products Group is a global leader in high-speed interconnect
solutions serving the AI, cloud, networking, storage, and telecommunications
markets. Our innovative connector, cable assembly, and system-level solutions
enable next-generation computing platforms deployed by the world's leading
hyperscale, OEM, and ODM customers.

We are seeking a highly motivated Senior Application Development Engineer to
drive the development and deployment of advanced High-Speed IO (HSIO)
connectivity and liquid cooling solutions for next-generation AI and data center
infrastructure. This role combines customer-facing technical leadership with
product development, system architecture, and cross-functional engineering
collaboration.

The successful candidate will work directly with hyperscale customers, OEMs,
ODMs, and internal engineering teams to develop innovative interconnect and
thermal management solutions that address complex system-level challenges. This
position requires a strong understanding of high-speed connectivity, mechanical
integration, thermal architecture, and customer-driven product development.

Key Responsibilities

Customer Engagement & Technical Leadership

Serve as the primary technical interface between customers, ODMs, OEMs, and
Amphenol engineering teams.
Collaborate closely with customers to understand system requirements and
recommend optimal HSIO interconnect and liquid cooling solutions.
Influence customer platform architectures through technical consultation and
early-stage design engagement.
Provide guidance on product selection, integration strategies, performance
optimization, and deployment best practices.
Conduct technical reviews, training sessions, workshops, and customer
presentations.
Support strategic customer programs from concept through production
deployment.
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- HSIO Connector & Cable Assembly Development

Lead development and customization of high-speed connector solutions for AI,
networking, storage, and server applications.
Collaborate with product engineering teams to define electrical, mechanical,
thermal, and manufacturability requirements.
Support development of next-generation HSIO connector technologies up to
448G and beyond.
Develop engineering concepts, prototypes, and demonstration systems to
validate customer solutions.
Create detailed engineering documentation, drawings, specifications, and
application guidelines.
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- Liquid Cooling & Thermal Solution Development

Partner with customers to develop liquid cooling architectures for AI
servers, accelerators, networking equipment, and rack-scale systems.
Integrate liquid cooling technologies with HSIO connector solutions while
maintaining electrical, thermal, and mechanical performance requirements.
Support evaluation and implementation of cold plates, manifolds, blind-mate
fluid connectors, quick disconnects, CDUs, and rack-level cooling
infrastructure.
Collaborate with thermal engineering teams to optimize coolant routing,
serviceability, reliability, and manufacturability.
Support development, testing, and validation of thermal and mechanical
prototypes.
Troubleshoot integration challenges during customer development and
deployment phases.
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- System Architecture & Solution Development

Work with customers to define complete system-level architectures
incorporating connectivity, cable management, thermal solutions, and mechanical
packaging.
Develop reference designs and integration methodologies for AI, HPC,
networking, and cloud infrastructure platforms.
Evaluate mechanical, thermal, manufacturing, and operational tradeoffs to
optimize overall system performance.
Support platform bring-up, validation, and qualification activities at
customer and ODM sites.
Develop tools, fixtures, and installation methodologies that improve
deployment efficiency and serviceability.
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- Project…