Mechanical Application Development Engineer

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world's largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors, sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications, including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Amphenol High Speed Products Group is a global leader in high-speed interconnect solutions serving the AI, cloud, networking, storage, and telecommunications markets. Our innovative connector, cable assembly, and system-level solutions enable next-generation computing platforms deployed by the world's leading hyperscale, OEM, and ODM customers.

We are seeking a highly motivated Mechanical Application Development Engineer to drive the development and deployment of advanced High-Speed IO (HSIO) connectivity and liquid cooling solutions for next-generation AI and data center infrastructure. This role combines customer-facing technical leadership with product development, system architecture, and cross-functional engineering collaboration.

The successful candidate will work directly with hyperscale customers, OEMs, ODMs, and internal engineering teams to develop innovative interconnect and thermal management solutions that address complex system-level challenges. This position requires a strong understanding of high-speed connectivity, mechanical integration, thermal architecture, and customer-driven product development.

• Serve as the primary technical interface between customers, ODMs, OEMs, and Amphenol engineering teams.
• Collaborate closely with customers to understand system requirements and recommend optimal HSIO interconnect and liquid cooling solutions.
• Influence customer platform architectures through technical consultation and early-stage design engagement.
• Provide guidance on product selection, integration strategies, performance optimization, and deployment best practices.
• Conduct technical reviews, training sessions, workshops, and customer presentations.
• Support strategic customer programs from concept through production deployment.

• Lead development and customization of high-speed connector solutions for AI, networking, storage, and server applications.
• Collaborate with product engineering teams to define electrical, mechanical, thermal, and manufacturability requirements.
• Support development of next-generation HSIO connector technologies up to 448G and beyond.
• Develop engineering concepts, prototypes, and demonstration systems to validate customer solutions.
• Create detailed engineering documentation, drawings, specifications, and application guidelines.

• Partner with customers to develop liquid cooling architectures for AI servers, accelerators, networking equipment, and rack-scale systems.
• Integrate liquid cooling technologies with HSIO connector solutions while maintaining electrical, thermal, and mechanical performance requirements.
• Support evaluation and implementation of cold plates, manifolds, blind-mate fluid connectors, quick disconnects, CDUs, and rack-level cooling infrastructure.
• Collaborate with thermal engineering teams to optimize coolant routing, serviceability, reliability, and manufacturability.
• Support development, testing, and validation of thermal and mechanical prototypes.
• Troubleshoot integration challenges during customer development and deployment phases.

• Work with customers to define complete system-level architectures incorporating connectivity, cable management, thermal solutions, and mechanical packaging.
• Develop reference designs and integration methodologies for AI, HPC, networking, and cloud infrastructure platforms.
• Evaluate mechanical, thermal, manufacturing, and operational tradeoffs to optimize overall system performance.
• Support platform bring-up, validation, and qualification activities at customer and ODM sites.
• Develop tools, fixtures, and installation methodologies that improve deployment efficiency and serviceability.

• Manage multiple concurrent customer development projects through all phases of the product lifecycle.
• Coordinate activities among global engineering, product management, manufacturing, and sales organizations.
• Provide regular technical and program status updates to…