Packaging SBU Product Line Management IV E4

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build, and service cutting‑edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

Salary: $ - $

Location: Santa Clara, CA

We offer a comprehensive benefits package and programs that support personal and professional growth, including health and wellbeing programs. For more details, visit our Careers website.

The Applied Global Services (AGS) Packaging Service Business Unit (SBU) is seeking an ambitious candidate that possesses strong technical knowledge of wafer‑level packaging semiconductor equipment in hardware design, process engineering, customer fab operations, and business acumen. This person will work closely with BU product development and field support, AGS operations, and AGS field service to ensure products have the documentation, spare part sourcing strategies, and maintenance capabilities required to be successful at customer sites.

They will engage in early phases of the new product design cycle to ensure after‑sale support planning is included from initial concept through final product release. An ideal candidate should have strong technical knowledge of packaging equipment, demonstrated technical program management skills, and strong communication skills. This is a strategic role that will suit someone who can drive growth, partnering across the organization to identify and solve customer high‑value problems.

• Lead HVP (High Value Problem) discovery through VOC (Voice of Customer) & FSO.
• Propose and select appropriate solutions based on ROI estimates.
• Lead team to assess Market Opportunity and select beta sites.
• Chair regular Core Team meetings to drive design & development of proposed solutions through internal cross‑functional teams (OCE, DT/AIx, FV, BU).
• Be accountable for successful beta demonstration by working with FSO, FSO Focals, AGS Focals responsible for the beta site.
• Drive creation of Marketing Collateral, Technical Procedures, and Field Training for sales and BD, CE’s and PSE’s that will support the service agreements enabled by the Service Product.
• Collaborate with AGS focal team to report on service revenue generated by the new Service Product vs. forecast.
• Prepare and deliver MPR (Monthly Product Reviews) providing status updates and help needed to AGS executives throughout the Phase Gate release cycle.

• Work with Business Unit on their NPIs (New Product Introductions) and legacy tools to prepare and embed service product offerings.
• Spearhead AIx growth engine to develop new capability and enable service product offers.
• Interfaces with BU, FSO / PSE, and customer teams regarding technical requirements, analysis, schedule, deliverables, and closure.
• Collect validation data from demo sites, prepare summary reports and present these reports to SBU management.

• Accountable for driving the service readiness throughout the product life cycle of wafer fab equipment.
• Support internal and external documentation review for legacy and new products.
• Coordinate and implement Service Product Roadmap releases through program management process (training, documentation, spares readiness, part repair, etc.).
• Drive and influence tool design and tooling to protect company values and services.
• Participate in Design for Install & Design for Service programs.
• Works closely with business unit to introduce equipment special tooling.

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field.
• 3-5 years of wafer‑level packaging / application /…