Manufacturing Photolithography Process Engineer III

Company Overview

Fujifilm Dimatix, Inc. designs and manufactures durable, productive drop‑on‑demand inkjet printheads powering cutting‑edge systems across commercial printing, graphics, label & packaging, additive manufacturing, and life‑science research.

Develop and improve wafer fab MEMS processes, owning tools and processes to minimize yield loss, maximize performance, facilitate production support for inkjet print heads during and after transfer from design to production, sustain products with cost reductions and yield improvements, and interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Salary range: $135,000 - $165,000, commensurate with experience.

• Implement robust manufacturing systems to minimize yield loss, maximize Photolithography process performance…
• Own Photolithography processes and tools.
• Provide engineering support to key manufacturing operations.
• Work closely with R&D to transfer new products to manufacturing.
• Sustain, develop and improve wafer fab processes by working on a variety of Photolithography related processes (coating, exposure, develop, inspection, and measurement).
• Create ASML jobs, design masks and work on ASML stepper tool.
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Use good problem solving and project management skills to solve the wide array of technical product problems.
• Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
• Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
• Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

• Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience; experience should include process and design engineering work in a MEMS wafer fab.
• Must have related experience in semiconductor, MEMS manufacturing…
• Ability to find root causes of wafer fab problems.
• Excellent problem identification and problem‑solving skills.
• Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
• Ability to apply mathematical operations to tasks such as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
• Ability to respond to common inquiries or complaints from internal resources and customers.
• Ability to carry out data analysis using JMP, Minitab. Green or Black Belt preferably.
• Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

• Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
• Sitting one-third to two-thirds of the time.

• Works in wafer fabrication and clean room environment.
• Exposure to moderate noise levels.
• May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are closed after transferring waste to them.
  
  Report any incidents involving hazardous waste to supervisor.

• Other duties as may be assigned.
• Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.
• Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects…