Advanced Packaging Process Engineer III E3

Process Development Engineer

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

We are seeking a motivated and detail-oriented Process Development Engineer to join our team. This position offers a unique opportunity to work on advance packaging projects. The successful candidate will be working on process development related to packaging substrate fabrication.

Role Responsibilities:

• Start up and qualify new equipment
• Develop new processes and transfer to pilot production
• Establish metrology protocol
• Utilize statistical tools and software to analyze data and identify trends, anomalies, and opportunities for process optimization.
• Prepare detailed reports and presentations summarizing findings and recommendations.
• Support the development and implementation of process improvements based on experimental results.
• Maintain accurate documentation of experiments, methodologies, and results.

Qualifications:

• BS or MS Degree in Chemical Engineering, Material Science or a related field.
• Strong analytical skills and proficiency in data analysis
• Experience in back end of the line semiconductor or PCB device fabrication
• Excellent communication and teamwork skills.
• Ability to work independently and manage multiple tasks effectively.
• Attention to detail and a proactive approach to problem-solving.

Preferred Qualifications:

• Experience in Cu electroplating processes
• Experience with electronic packaging fabrication and characterization techniques.
• Previous hand-on experience with tool operation and process development in PCB or semiconductor industry.

Additional Information:

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 10% of the Time

Relocation Eligible:
Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.