Process Engineer II - Dry Etch

Job Description

Salary range for position: $110,000 - $130,000, commensurate with experience.

Develop and improve wafer fab processes. Own tools and processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

A seasoned, experienced professional with a full understanding of area of specialization; resolves a wide range of issues in creative ways. This job is fully qualified, career-oriented, journey-level position.

Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors. Demonstrates good judgment in selecting methods and techniques for obtaining solutions. Networks with senior internal and external personnel in own area of expertise.

Normally receives little instruction on day-to-day works, general instructions on new assignments.

Typically requires a minimum of 5 years of related experience with a Bachelor's degree; or 3 years and a Master's degree or PhD without experience; or equivalent work experience.

• Develop and improve wafer fab processes (Silicon Oxide, Deep Silicon, Ion Mill…etch processes).
• Use and run wafer metrology tools to analyze problems, failures and other technical issues.
• Use good problem solving and project management skills to solve the wide array of technical product problems.
• Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
• Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
• Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

None

To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skill, and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

• Bachelor's degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 5 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.
• Must have related experience in Plasma Etching, Ash, photo processes…
• Ability to find root causes of wafer fab problems.
• Excellent problem identification and problem-solving skills.
• Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.
• Ability to apply mathematical operations to tasks such as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.
• Ability to respond to common inquiries or complaints from internal resources and customers.
• Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

• Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.
• Sitting one-third to two-thirds of the time.

• Works in wafer fabrication and clean room environment.
• Exposure to moderate noise levels.
• May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will ensure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are…