Package Design Engineer: SoC & SiP Innovation
Job in
Santa Clara, Santa Clara County, California, 95053, USA
Listed on 2026-07-22
Listing for:
Qualcomm
Full Time
position Listed on 2026-07-22
Job specializations:
-
Engineering
Electronics Engineer, Systems Engineer, Hardware Engineer
Job Description & How to Apply Below
Qualcomm is seeking a Staff Package Design Engineer in Santa Clara to own advanced package selection and SIP/SoC packaging. You will drive physical design, layout, DV, and tape-out, collaborating with multi-functional teams to optimize mechanical, electrical, and thermal performance for various chip types.
The role requires expertise in Cadence APD/SiP, Xpedition, and Calibre, with a strong background in high-speed interfaces (DDR, PCIe).
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