Product Engineer

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All Salaried exempt employees Full-Time Santa Clara, CA, US

4 days ago Requisition

Salary Range: $ To $ Annually

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28 th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors.

Together, these initiatives position the company as a leader in innovation for the 21st century.

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.

The Product Engineer is a vital technical liaison for the Silicon Valley AI Rack NPI Center, bridging the gap between R&D, customers, and the manufacturing floor for next-generation L11 AI server racks. Reporting to the ME Manager, this dual-focus role is responsible for both Product Specification management (BOM, ECN/ECO, product configuration) and Packaging Specification design. The ideal candidate will ensure that complex AI server products are built strictly to customer specifications and are securely packaged with industrial-grade, shock-absorbing solutions to withstand the rigors of global shipping.

• Product Specification & Change Management (ECO/ECN):
  Act as the owner of the Manufacturing Bill of Materials (MBOM) to translate customer specifications into manufacturing requirements, and lead the implementation of ECO/ECN without disrupting NPI schedules.
• Cross-Functional Issue Resolution:
  Serve as the primary ME contact for product-level issues, collaborating with R&D, Quality, Testing, and Supply Chain to resolve design bugs, parts shortages, and assembly deviations.
• Heavy-Duty Packaging Design:
  Lead the design, specification, and validation of custom wooden crates, heavy-duty shock-absorbing pallets, and structural ramps for extremely heavy L11 AI Racks.
• Packaging Validation & Testing:
  Coordinate packaging reliability testing (such as drop, shock, vibration, and tilt tests), ensuring liquid cooling (DLC) systems are protected and tilt/shock indicators are utilized during transit.
• Standardization & Documentation:
  Create and maintain comprehensive Packaging Standard Operating Procedures (SOPs) and Product Configuration guides, ensuring packing line operators are properly trained.

• A Bachelor's degree is required for this position.
• The degree must be in Industrial Engineering, Mechanical Engineering, Packaging Engineering, or a related technical field.

• Industry & Product
  
  Experience:
  
  4 - 7 years of experience in Product Engineering, NPI, or Packaging Engineering within the electronics manufacturing or server industry, with direct experience required in L10/L11/L12 server racks or heavy industrial equipment packaging.
• Systems & Standards Proficiency:
  Proven experience managing complex BOMs and ECN/ECO processes using PLM/ERP systems (e.g., Agile, SAP, Windchill), as well as…