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Product Engineer

Job in Santa Clara, Santa Clara County, California, 95050, USA
Listing for: Foxconn Technology Group
Full Time position
Listed on 2026-08-05
Job specializations:
  • Engineering
    Packaging Engineer, Systems Engineer, Product Engineer, Manufacturing Engineer
Job Description & How to Apply Below

Product Engineer

The Product Engineer is a vital technical liaison for the Silicon Valley AI Rack NPI Center, bridging the gap between R&D, customers, and the manufacturing floor for next-generation L11 AI server racks. Reporting to the ME Manager, this dual-focus role is responsible for both Product Specification management (BOM, ECN/ECO, product configuration) and Packaging Specification design. The ideal candidate will ensure that complex AI server products are built strictly to customer specifications and are securely packaged with industrial-grade, shock-absorbing solutions to withstand the rigors of global shipping.

Duties and Responsibilities:

  • Product Specification & Change Management (ECO/ECN):
    Act as the owner of the Manufacturing Bill of Materials (MBOM) to translate customer specifications into manufacturing requirements, and lead the implementation of ECO/ECN without disrupting NPI schedules.
  • Cross-Functional Issue Resolution:
    Serve as the primary ME contact for product-level issues, collaborating with R&D, Quality, Testing, and Supply Chain to resolve design bugs, parts shortages, and assembly deviations.
  • Heavy-Duty Packaging Design:
    Lead the design, specification, and validation of custom wooden crates, heavy-duty shock-absorbing pallets, and structural ramps for extremely heavy L11 AI Racks.
  • Packaging Validation & Testing:
    Coordinate packaging reliability testing (such as drop, shock, vibration, and tilt tests), ensuring liquid cooling (DLC) systems are protected and tilt/shock indicators are utilized during transit.
  • Standardization & Documentation:
    Create and maintain comprehensive Packaging Standard Operating Procedures (SOPs) and Product Configuration guides, ensuring packing line operators are properly trained.

Education:

  • A Bachelor's degree is required for this position.
  • The degree must be in Industrial Engineering, Mechanical Engineering, Packaging Engineering, or a related technical field.

Experience:

  • Industry & Product

    Experience:

    4 - 7 years of experience in Product Engineering, NPI, or Packaging Engineering within the electronics manufacturing or server industry, with direct experience required in L10/L11/L12 server racks or heavy industrial equipment packaging.
  • Systems & Standards Proficiency:
    Proven experience managing complex BOMs and ECN/ECO processes using PLM/ERP systems (e.g., Agile, SAP, Windchill), as well as familiarity with ISTA or ASTM packaging test standards for heavy machinery.
  • Cross-Functional Communication:
    Excellent communication skills with the demonstrated ability to interface effectively with global R&D teams and demanding Tier-1 customers.

EEOC Statement

Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law.

In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.

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