Global Product Support (GPS) Engineer - Advanced Packaging
Job in
Santa Clara, Santa Clara County, California, 95054, USA
Listed on 2026-08-08
Listing for:
Applied Materials
Full Time
position Listed on 2026-08-08
Job specializations:
-
Engineering
Systems Engineer, Process Engineer, Manufacturing Engineer
Job Description & How to Apply Below
* Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT.
If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
** What We Offer*
* Salary:
$ - $
Location:
Santa Clara,CA
You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits () .
** Position Summary*
* Applied Materials is seeking a Global Product Support (GPS) Engineer to support installation, startup, qualification, and ongoing operation of the Kinex Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.
The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.
** Key Responsibilities*
* ** Installation & Startup*
* + Support Kinex installation activities from tool dock through release to engineering users
+ Coordinate Tier 0, Tier 1 and Tier 2 startup activities
+ Drive closure of installation punch-list items
+ Support factory acceptance and site acceptance activities with vendors
+ Develop recovery plans for installation and startup issues
** Facilities Integration*
* + Support Facility Data Sheet (FDS) development and updates
+ Coordinate with Facilities, EHS and infrastructure teams
+ Define and validate tool utility requirements
+ Support hookup and qualification activities
** Equipment Support*
* + Perform troubleshooting of mechanical, electrical, automation, and process-related issues
+ Develop preventative maintenance procedures
+ Support uptime improvement efforts
+ Analyze equipment performance and reliability trends
+ Drive root cause investigations and corrective actions
** Vendor & Product Engineering Engagement*
* + Act as primary technical interface with BESI and Kinex product engineering teams
+ Coordinate technical reviews, service activities, upgrades, and modifications
+ Manage escalation of hardware and software issues
+ Support implementation of engineering changes and new capabilities
** Advanced Packaging Development Support*
* + Support hybrid bonding process development activities
+ Work closely with CTO process engineers and researchers
+ Enable wafer-to-wafer and die-to-wafer bonding development
+ Support new module integration and experimental hardware evaluations
** Minimum Qualifications*
* + BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline
+ 3-7 years of engineering experience in semiconductor equipment - new college graduates applications will NOT be considered
+ Experience supporting semiconductor manufacturing or development equipment
+ Strong troubleshooting and root-cause analysis skills
+ Excellent verbal and written communication skills
+ Ability to work across facilities, vendors, process engineering, and operations teams
** Preferred Qualifications*
* ** Highly Desired*
* +
Experience with advanced packaging equipment
+
Experience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems
+
Experience with wet clean processes and systems
+ Equipment installation and startup experience
+ Facilities hookup and utility integration experience
+ Vendor management and supplier coordination experience
+ Hands-on experience troubleshooting complex semiconductor equipment
** Preferred*
* + Knowledge of:
+ Automated material handling systems
+ Vacuum systems
+ Plasma processing systems
+ Wet processing equipment
+ Metrology systems
+ Experience generating or reviewing:
+ Site prep / installation…
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