Tech Proj​/Prog Manager IV

Job Title

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field

• Interprets internal/external business challenges and recommends best practices to improve products, processes or services

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions

• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies

• Communicates difficult concepts and negotiates with others to adopt a different point of view

Special Substrate Handling (SSH) is a strategic differentiator that enables semiconductor manufacturers to process increasingly complex non-standard substrates including warped wafers, glass carriers, stacked wafers, thick substrates, rectangular panels, and other advanced package structures that cannot be handled using conventional wafer automation systems. SSH combines specialized hardware, robotics, sensors, algorithms, and software controls to ensure reliable transport, alignment, and processing of these substrates while maintaining yield and productivity.

This capability is becoming increasingly important as AI-driven demand accelerates the adoption of advanced packaging technologies such as CoWoS, chiplets, 2.5D/3D integration, panel-level packaging (e.g. CoPoS), and glass-core substrates. These next-generation architectures require larger, heavier, thinner, and more fragile substrates, creating significant handling challenges throughout the manufacturing flow. As a result, Special Substrate Handling is evolving from a niche engineering requirement into a critical enabler of AI and high-performance computing growth, unlocking new revenue opportunities, expanding platform applicability, improving customer time-to-market, and positioning Applied Materials to capture value across the rapidly growing advanced packaging ecosystem.

The industry specs/standards around these special substrates are evolutionary and emerging, unlike the mature standards for silicon wafers. Enterprise materials indicate SSH requests have…