Sr. Director, Package Development Engineering

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Full-time Regular Santa Clara, CA, US

SiTime is the Precision Timing company.

Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit:  .

SiTime seeks a seasoned leader to drive its packaging technology. This individual will drive the execution of SiTime’s innovative packaging roadmap. SiTime’s packaging leverages conventional and advanced wafer scale packaging technologies to create thermally and mechanically stable environments for co-packaged MEMs. The successful candidate will have expertise in leading innovative teams, incorporating new materials, and a track record of collaborating closely with development partners.

A curiosity to transcend the status quo is welcome and silicon process technology development experience is a strong plus

• Packaging Roadmap & Architecture: Define the packaging roadmap that creates the technical capabilities to enable product performance, form-factor, reliability and cost. Define package requirements and target assembly flows aligned to quality and reliability specifications.
• OSAT Development
  
  Collaboration:
  
  Lead technical relationships with OSAT partners to align and implement SiTime’s packaging roadmap. Build and manage local teams at key OSAT sites to accelerate development velocity and transfer to production. Manage key issues and risk burn down in the design, NPI, qualification and volume phases. Develop yield improvement and supply increase plans.
• Mechanical Design: Oversee design, analysis and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability.
• Electrical Interface Optimization: Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity.
• Advanced Material Characterization: Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds in alignment with suppliers.
• Packaging Laboratory: Drive workflows to accelerate screening of alternative materials and characterization of package performance and reliability.
• Productivity: Define best practices and manage KPI metrics for all aspects of package development process and package lifecycle.
• Team Leadership: Track record of talent and leadership development of engineers and technicians to create high-performance, execution-focused teams.

• Education: Ph.D. or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
• Experience: 10+ years of experience in semiconductor packaging R&D, with at least 5 years leading teams focused on advanced heterogeneous integration.
• Technical Depth: Expertise in semiconductor materials, process integration, process engineering and metrology. Develop workflows with EDA tool chains and calibrating measurements to attain predictive performance. Implement automated process control strategies to ensure volume manufacturability and quality.
• OSAT/Foundry Management: Demonstrated expertise in collaborating with OSATs and semiconductor foundries. Understand differences between different supplier capabilities to establish an OSAT-specific execution framework.
• Global Teams: Experience in managing high-performance, geographically distributed teams with centers of…