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Senior Field Applications Engineer - Packaging & Projects

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: Tata Electronics
Full Time position
Listed on 2026-08-22
Job specializations:
  • Engineering
    Packaging Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 150000 - 210000 USD Yearly USD 150000.00 210000.00 YEAR
Job Description & How to Apply Below

Tata Electronics Private Limited (TEPL) seeks a Senior Technical Program Manager to support the VP of field application engineering. Must have hands-on semiconductor packaging experience including flip chip, bumping, and wafer-level packaging; coordinate with RnD, NPI, SCM, and Production to ensure successful customer projects.

Strong communication, problem-solving, and collaboration skills are essential to build trust and drive milestones in a fast-paced environment.

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Position Requirements
10+ Years work experience
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