Photonic Engineer, Senior

Company

Qualcomm Atheros, Inc.

Engineering Group, Engineering Group > RFIC Design

Define, design, and develop photonic integrated circuits for next-generation silicon photonics platforms targeting high-speed optical interconnect and DWDM transceiver applications. Perform photonic device design covering both active components and passive components using 3D structure simulation tools and foundry PDKs. Collaborate cross-functionally with other designers, and systems teams in a DWDM transceiver product project. Utilize script-based workflow with AI to automate simulation, layout generation, and data analysis.

Work with testing engineers on post-fabrication device characterization in the lab to validate designs and close the loop between simulation and hardware.

• Bachelor's degree in EE, Physics, Optics, or related field with 5+ years of PIC design experience, OR
• Master's degree in EE, Physics, Optics, or related field with 3+ years of PIC design experience, OR
• PhD in EE, Physics, Optics, or related field with 1+ year of PIC design experiences.
• 2+ years hands-on with:
  Lumerical (FDTD, MODE, CHARGE, INTERCONNECT), and any layout editor/viewer (Cadence Virtuoso, KLayout, or equivalent), and Python.
• Hands-on design experience with silicon-photonics foundry PDKs
• System-level understanding of optical link budgets, DWDM channel plans, OMA/TDECQ, and transceiver power allocation.

• 2+ years of Co-Packaged Optics (CPO) design experience — chip-to-chip optical coupling, CPO-specific constraints, or tape-out in a CPO-targeted node.
• 2+ years of PIC-EIC co-design — joint optimization for high-speed transceivers, including driver/TIA co-simulation with active photonic devices.
• System-level photonic simulation tools: VPI Photonics, Lumerical Zemax Optic Studio, or equivalent.
• DWDM wavelength control loops, thermal tuning, closed-loop resonance lock for ring-modulator transmitters.
• Track record of photonic tape-outs (MPW or full-reticle) with post-silicon characterization closure.
• Publication record or patent filings in integrated photonics.

• Design active (MRM, MZM, photodetectors) and passive (edge/grating couplers, power splitters, wavelength MUX/DEMUX) photonic devices from spec through tape-out using foundry PDKs and 3D structure optical simulation.
• Perform 3D photonic simulation (FDTD, MODE, INTERCONNECT, and CHARGE for carrier/electro-optic effects) to validate device performance and iterate to target specs.
• Develop and maintain script-based workflows — leveraging AI-assisted tooling — to automate parameter sweeps, layout generation, and measurement-data processing.
• Review and sign off on PIC physical layouts produced by the dedicated layout engineer from physical design team.
• Collaborate with other PIC designers, EIC designers, and package teams to run co-simulations. Align interface specs, and validate electro-optical performance in the full DWDM transceiver system.
• Execute and interpret post-fabrication characterization lab testing.
• Close the simulation-to-hardware loop by correlating characterization data with models and proposing corrections.
• Participate in cross-functional design reviews spanning component performance, tape-out readiness, and system link budget.
• Maintain internal technical documentation: design specs, simulation methodology, characterization reports, and tape-out checklists.
• Track silicon photonics, CPO, and DWDM transceiver developments, and apply emerging techniques to improve design quality and time-to-tape-out.

• Works under some supervision, with high independence for component-level design decisions.
• Provides technical guidance and layout-review feedback to layout engineers and junior team members.
• Owns design deliverables; errors may impact the tape-out schedule and require re-simulation or a re-spin.
• Communicates technical status, simulation results, and characterization findings to EIC designers, packaging engineers, and systems architects.
• Works within the tape-out schedule, reticle area budget, and PDK constraints.
• Has meaningful influence on component-level architecture and…