Capital Equipment Hardware engineer - Advanced Packaging

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology.

Salary: $ - $

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees.

We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Applied Materials is seeking a Global Product Support (GPS) Engineer( Capital Equipment Hardware engineer ) to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.

The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.

This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement.

The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.

• Installation & Startup Support Kinex installation activities from tool dock through release to engineering users
• Coordinate Tier 0, Tier 1 and Tier 2 startup activities
• Drive closure of installation punch-list items
• Support factory acceptance and site acceptance activities with vendors
• Develop recovery plans for installation and startup issues
• Facilities Integration Support Facility Data Sheet (FDS) development and updates
• Coordinate with Facilities, EHS and infrastructure teams
• Define and validate tool utility requirements
• Support hookup and qualification activities
• Equipment Support Perform troubleshooting of mechanical, electrical, automation, and process-related issues
• Develop preventative maintenance procedures
• Support uptime improvement efforts
• Analyze equipment performance and reliability trends
• Drive root cause investigations and corrective actions
• Vendor & Product Engineering Engagement Act as primary technical interface with BESI and Kinex product engineering teams
• Coordinate technical reviews, service activities, upgrades, and modifications
• Manage escalation of hardware and software issues
• Support implementation of engineering changes and new capabilities
• Advanced Packaging Development Support Support hybrid bonding process development activities
• Work closely with CTO process engineers and researchers
• Enable wafer-to-wafer and die-to-wafer bonding development
• Support new module integration and experimental hardware evaluations

BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline 3–7…