Packaging Innovation Architect: .5D/3D Hybrid Bonding
Listed on 2026-10-06
-
Engineering
-
Design & Architecture
Applied Materials, Inc. in Santa Clara is seeking an Advanced Packaging Integration Engineer to lead process integration for high‑performance interconnects and micro‑LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while collaborating with fabs, OSATs, suppliers, and cross‑functional teams across design, process, integration, and metrology.
The role requires a Ph.D. or M.S.
We have an opening for a Packaging Innovation Architect: 2.5D/3D Hybrid Bonding in Santa Clara, CA, United States within Engineering.
Learn more about the Packaging Innovation Architect: 2.5D/3D Hybrid Bonding role in the description above.
We appreciate your interest in this position.
Join Applied Materials, Inc. and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Packaging Innovation Architect: 2.5D/3D Hybrid Bonding role at Applied Materials, Inc., based in Santa Clara, CA, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).