Packaging Engineer II - Build -Gen Chip Packaging
Listed on 2026-10-06
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Engineering
Packaging Engineer, Manufacturing Engineer, Materials Engineering, Process Engineer -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer, Materials Engineering
Applied Materials, Inc. in Santa Clara, CA is seeking a New College Graduate to join our Packaging Engineering team. You will develop, implement, and maintain packaging designs and generate material specifications.
Research packaging materials and methods that benefit the business; perform root cause analysis on simple packaging failures and pursue cost-saving initiatives. Requirements include a Master’s Degree in Mechanical Engineering or Packaging Engineering with a 3.0+ GPA; travel is up to
The Packaging Engineer II
- Build Next-Gen Chip Packaging position in the Engineering field is open for applications.
Join Applied Materials, Inc. and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Packaging Engineer II
- Build Next-Gen Chip Packaging role at Applied Materials, Inc., based in Santa Clara, CA, United States.
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