Head of DIC & Advanced Packaging
Listed on 2026-10-07
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Management
Siemens EDA is seeking a proven leader to head the Technology Solutions Sales organization for 3
DIC and Advanced Packaging in Santa Clara, CA. The role focuses on turning early momentum into scalable, repeatable growth.
You will align with regional Sales, Technical Sales, and Portfolio Unit teams to surface opportunities and drive 3
DIC growth, while coaching a high‑performing team of Account Technology Managers to win in a fast‑moving market.
We are currently recruiting a Head of 3
DIC & Advanced Packaging Growth for our team in Santa Clara, CA, United States.
For the Head of 3
DIC & Advanced Packaging Growth position at Siemens EDA (Siemens Digital Industries Software), we are reviewing applications now.
Step into the Head of 3
DIC & Advanced Packaging Growth role at Siemens EDA (Siemens Digital Industries Software) in Santa Clara, CA, United States and grow with us.
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