Program Manager – Advanced Packaging; E4

Position: Program Manager – Advanced Packaging (E4)
:
Program Manager – Advanced Packaging (E4)
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Program Manager – Advanced Packaging (E4) page is loaded## :
Program Manager – Advanced Packaging (E4)
Apply locations:
Santa Clara,CAtime type:
Full time posted on:
Posted Todayjob requisition :
R2620568
** Who We Are
** Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
** What We Offer
** Salary:$ - $

Location:

Santa Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
** Key Responsibilities**
* ** Customer Engagement Leadership**  + Lead end-to-end customer programs, including
** technical alignment, schedule execution, and resource coordination**  + Serve as the primary interface between IMS, internal business units, and external customers  + Drive proactive communication and issue resolution to ensure program success
* ** Program Execution & Delivery**  + Manage complex, multi-disciplinary programs across global teams  + Own
** program timelines, milestones, risk management, and deliverables**  + Ensure alignment across IMS, business units, BD and customer accounts teams
* ** Technical Strategy & Expertise**  + Apply in-depth knowledge of
** advanced packaging inflections
** including:
- Logic (2.5D/3D integration, chiplets, hybrid bonding)    - DRAM (HBM, TSV-based integration)    - NAND (3D NAND scaling and packaging trends)  + Translate customer needs into
** IMS solution strategies**
* ** Value Articulation**  + Clearly communicate and position
** IMS value propositions
** to:
- Internal Applied Materials business units    - External customers and partners  + Support business growth through
** technical storytelling and solution alignment**
* ** Cross-Functional Collaboration**  + Work seamlessly with
** globally distributed teams
** across engineering, sales, and operations  + Foster a collaborative, high-performance team environment
** Qualifications
* * Required
* *
* Education:

**  + Bachelor’s or Master’s degree in
** Electrical Engineering, Mechanical Engineering, Materials Science**, or equivalent
* *
* Experience:

**  + Minimum
** 5 years of program management experience
** in a
** customer-facing role**  + Proven track record of successfully driving
** technical programs with external customers**
* ** Technical Expertise:**  + Strong understanding of
** advanced semiconductor packaging technologies
** across logic, DRAM, and NAND
* ** Skills &

Competencies:

**  + Excellent
** communication and presentation skills**  + Ability to clearly articulate complex technical concepts and value propositions  + Strong
** organizational and project management skills**  + Demonstrated ability to manage
** multiple priorities in a dynamic environment**
* ** Work Style:**  + Self-starter with the ability to work
** independently with minimal…