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Principal Ethernet Scale-Out Architect, AI Data Center

Job in Santa Clara, Santa Clara County, California, 95053, USA
Listing for: Qualcomm
Full Time position
Listed on 2026-09-12
Job specializations:
  • Manufacturing / Production
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 192000 - 304900 USD Yearly USD 192000.00 304900.00 YEAR
Job Description & How to Apply Below

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General

Summary:

Qualcomm is seeking an experienced Hardware Scale-Out Architect to help define the next generation of AI datacenter products. This role is responsible for architecting large-scale Ethernet-based AI/datacenter fabrics that connect servers, accelerators, racks, and multi‑rack clusters. The ideal candidate will bring deep expertise across Ethernet, UEC, RoCE/RDMA, NICs/SuperNICs, scale‑out switches, scale‑up interconnects, and end‑to‑end system data movement.

Minimum Qualifications:
  • Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.
  • OR
  • Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.
  • OR
  • PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.
Responsibilities:
  • Define next‑generation scale‑out network architectures for AI and cloud datacenter deployments.
  • Develop end‑to‑end system architecture spanning accelerator cards, servers, racks, and multi‑rack clusters.
  • Drive architecture and requirements for Ethernet fabrics, NICs/SuperNICs, switch ASICs, transport protocols, in‑network collectives, telemetry, security, virtualization, RAS, and reliability features.
  • Analyze DMA engines, data flows, packet flows, and system bottlenecks to optimize bandwidth, latency, utilization, and scalability.
  • Collaborate with software, SoC design, card design, platform, and validation teams to realize connectivity solutions for AI scale‑up and scale‑out deployments.
  • Provide technical leadership across physical, link, transaction, transport, and protocol layers of high‑speed interfaces and datacenter networking systems.
Requirements:
  • 8+ years of hardware architecture, design, validation, testing, or commercialization experience in datacenter, networking, accelerator, or high‑speed I/O products.
  • Strong understanding of Ethernet, Infini Band, RoCEv2, RDMA, and related transport protocols.
  • Ability to work closely with software teams to optimize end‑to‑end data movement for high bandwidth, low latency, and efficient resource utilization.
  • 3+ years of experience with datacenter products such as servers, accelerators, NICs, switches, racks, or cluster‑scale systems.
  • Strong knowledge of scale‑out networking and scale‑up interconnect architectures for AI and cloud infrastructure.
  • In‑depth knowledge of Ethernet, high‑speed Ser Des, PCIe/CXL‑class interfaces, and board/system‑level connectivity tradeoffs.
  • Strong understanding of telemetry, observability, RAS, reliability, error handling, and failure‑mode analysis in large‑scale systems.
  • Strong understanding of security, isolation, virtualization, and multi‑tenant deployment requirements in datacenter environments.
  • Strong understanding of DMA engines, memory hierarchy, I/O virtualization, and accelerator data‑movement architectures.
  • Ability to operate effectively in a high‑caliber, cross‑functional, international, and multi‑site engineering environment.
Preferred

Skills and Experience:
  • Good understanding of PCIe, CXL, and UCIe protocols and their use in accelerator, server, and rack‑scale architectures.
  • Familiarity with Ethernet switch management and control‑plane ecosystems such as SONiC, SAI, OpenBMC, Linux networking, and related platform software.
  • Good understanding of high‑speed Ser Des and Ethernet PHY design considerations, including signal integrity, reach, power, latency, and platform tradeoffs.
  • Ability to work with customers, product management, architecture, and engineering teams to…
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