Senior Process and Integration Engineer

Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Join Keysight's Microcircuit Assembly R&D team and help define the advanced manufacturing technologies that power the next generation of electronic test and measurement solutions. In this senior, hands‑on engineering role, you'll lead the development of innovative manufacturing processes, solve complex technical challenges, and drive New Product Introduction (NPI) initiatives from concept through production. Working across materials, mechanical, electrical, and manufacturing disciplines, you'll serve as a trusted technical resource and subject matter expert, collaborating with cross-functional teams to deliver breakthrough products supporting communications, aerospace and defense, automotive, semiconductor, and emerging technology markets.

• Serve as the subject matter expert (SME) and technical lead for microcircuit assembly processes - epoxy dispensing, gold‑gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), automatic placement, soldering, silver sintering, and plasma cleaning - providing technical direction across R&D, Manufacturing, and Quality.
• Act as the process team's technical lead on New Product Introduction (NPI) programs, representing process engineering in design reviews, program reviews, and cross‑functional decision forums.
• Lead Design for Manufacturability (DFM) reviews and formal risk assessments (e.g., FMEA) for new products and process changes; identify and drive mitigation of manufacturability and yield risks ahead of production.
• Influence product and package design decisions upstream by advising R&D and design teams on manufacturability, process capability, and assembly constraints.
• Make strategic technical decisions that affect build schedule, capacity, and production readiness, weighing risk, cost, and timeline trade‑offs.
• Lead process development projects end to end: define scope and technical approach, plan resources and schedule, and drive execution to qualified, production‑ready processes.
• Own qualification of new equipment, materials, and processes; drive continuous improvement in yield, capability, and efficiency across the group's core assembly processes.
• Contribute to and help shape the department's technology roadmap by evaluating emerging assembly technologies and recommending strategic capability investments.
• Provide technical mentorship and guidance to junior and mid‑level process engineers and technicians.
• Author and own process documentation, engineering reports, and manufacturing specifications at a level suitable for design reviews, audits, and customer‑facing reviews.

Minimum Requirements

• Master's in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Physics, or a related engineering discipline preferred. Candidates with a Bachelor's degree and significant directly related experience will also be considered.
• 8+ years of relevant hands‑on experience in microelectronics, microcircuit assembly, semiconductor packaging, or precision manufacturing process development.
• Demonstrated experience leading process development projects and/or serving as the technical point of contact on NPI programs.
• Hands‑on depth in one or more of the following: epoxy dispensing, wire bonding, ball bonding, gold stud bump and flip chip bonding, automatic placement, silver sintering, or soldering.
• Proven track record applying DOE, statistical analysis, and root cause methodologies to…