Senior PCB Layout Engineer - Avionics

Overview

Ready to make connectivity from space universally accessible, secure and actionable? Then you’ve come to the right place!

E-Space is bridging Earth and space to enable hyper-scaled deployments of Internet of Things (IoT) solutions and services. We are building a highly-advanced low Earth orbit (LEO) space system that will fundamentally change the design, economics, manufacturing and service delivery associated with traditional satellite and terrestrial IoT systems.

We’re intentional, we’re unapologetically curious and we’re 100% committed to innovate space-based communications and deliver actionable intelligence that will expand global economies, protect space and our planet and enhance our overall quality of life.

The Senior PCB Layout Engineer is responsible for leading the physical implementation of complex, high-performance printed circuit boards from concept through production. This role requires deep expertise in multi-layer, high-speed, RF, and mixed-signal PCB layout, strong ownership of stackup and via architecture decisions, and direct engagement with PCB fabrication and assembly partners to ensure manufacturability, reliability, and cost efficiency.

• Technical Leadership
  • Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry
  • Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, back drilling)
  • Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability
• Advanced PCB Design & Layout
  • Perform and guide component placement optimizing signal integrity, power integrity, EMI/EMC, thermal, and mechanical performance
  • Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals
  • Design robust power distribution networks and grounding structures
  • Apply advanced shielding and isolation techniques for EMI/EMC control
• Fabrication & Assembly Interface
  • Lead DFM/DFA reviews with PCB fabrication and assembly partners
  • Resolve complex DFM issues related to: o HDI structures and sequential lamination; o Via consolidation, back drilling, and drill count reduction; o Stackup optimization for yield and cost
  • Optimize designs for manufacturability, reliability, and volume production
• Cross-Functional Collaboration
  • Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle
  • Support board bring-up, debug, ECOs, and production transitions
  • Mentor and technically guide junior PCB layout engineers
• Documentation & Process Ownership
  • Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)
  • Establish, maintain, and enforce PCB layout standards and best practices
  • Drive continuous improvement in layout quality, DFM compliance, and cost efficiency

What you bring to this role

• 7+ years of hands-on PCB layout experience delivering complex designs from concept to production
• Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro
• PCB stack-up development for digital, power, and RF designs
• Impedance-controlled routing and transmission-line design
• Power-distribution layout, plane design, and current-density management
• Mixed-signal layout techniques (digital, analog, RF isolation and partitioning)
• Component placement strategy for manufacturability, signal integrity, and thermal performance
• Design-rule and constraint creation (clearances, lengths, impedance, vias, creepage/clearance)
• Layout documentation (fab drawings, assembly drawings, layer stack tables, notes)
• Footprint library creation and maintenance;
  Altium librarian responsibilities
• Understanding of high-speed signal attenuation, dispersion, and copper-loss mechanisms
• Crosstalk awareness and mitigation through routing and spacing techniques
• RF parasitic effects (stray C/L/R) and reduction methods in layout
• RF isolation techniques (ground fencing, stitching vias, partitioning, shielding)

• Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a…