Semiconductor Packaging Modeling and Simulation Engineer

Semiconductor Packaging Modeling and Simulation Engineer

Scottsdale, AZ, United States and 1 more

onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in (Phoenix AZ or San Jose, CA). As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers worldwide.

• Do thermal-mech simulation for microelectronic packaging and system, assembly process such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models

• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability
• Good team player

• Base salary range: $146,970 to $249,780 (exclusive of fringe benefits or potential bonuses). Final pay rate depends on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members.
• Competitive benefits package. For more details see

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact  for assistance.