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SiC Wafer and Technology Development Engineer

Job in Scottsdale, Maricopa County, Arizona, 85261, USA
Listing for: onsemi
Full Time position
Listed on 2026-06-06
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering, Process Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: SiC Wafer and Package Technology Development Engineer

SiC Wafer and Package Technology Development Engineer

Scottsdale, AZ, United States and 1 more

Job Description

Technical and customer support for the qualification of SiC die sales and development

SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi.

Responsibilities
  • Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
  • Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
  • Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
  • Document findings and process flows to create baseline for new technology platforms
  • Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
Qualifications
  • Ability to lead development projects and implement strategies on a global basis
  • Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding
  • Knowledge of materials and material interactions
Required Skills
  • Influence & Presence
  • Metallization
  • Program Management
  • Semiconductor packaging

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression or any other protected category under applicable federal, state or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact  for assistance.

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