Sr. Manager Product

The Product Applications Engineer will serve as a technical expert and customer advocate for our Non-Volatile Memory (NVM) portfolio, specifically EEPROM and ReRAM
-based products. This role combines hands‑on technical support, product definition, and cross‑functional collaboration to ensure successful integration and adoption of our memory solutions across automotive, industrial, and consumer markets.

• Customer Engagement & Technical Support:
  Act as the primary technical liaison for customers, understanding system-level requirements and performance goals.
• Provide design-in support for EEPROM and ReRAM products, including troubleshooting and optimization.
• Develop technical documentation, application notes, and training materials for internal teams and external partners.
• Product Definition & Development:
  Translate customer requirements into product specifications and datasheets.
• Collaborate with design, validation, and test teams to ensure product features align with market needs.
• Support evaluation boards, reference designs, and solution kits for new product introductions.
• Cross‑Functional
  
  Collaboration:
  
  Work closely with marketing, sales, and FAEs to drive product positioning and competitive differentiation.
• Provide technical insights for go‑to‑market strategies and promotional activities.
• Analyze market trends and competitive offerings in EEPROM and ReRAM technologies.
• Identify opportunities for new product development and enhancements.

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• 7+ years of experience in applications engineering or product support, preferably with EEPROM, ReRAM, or other NVM technologies.
• Strong knowledge of memory architectures, interface protocols (I²C, SPI, etc.), and embedded systems.
• Familiarity with circuit design, PCB layout, and mixed‑signal concepts.
• Excellent communication skills for customer‑facing interactions and technical presentations.
• Ability to travel domestically and internationally as required.

• Experience in automotive, industrial, or telecom applications.
• Understanding of IC packaging and electronic measurement techniques.

Relocation assistance will be offered for those who qualify.