Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers, leading new technology adoption for large‑scale server deployments to deliver a world‑class customer experience. You will work across multiple technology domains, pushing for improvements in performance, quality and cost.

• Design and build the thermal and mechanical systems that power the world's largest computing infrastructure.
• Develop solutions from circuit level up through system architecture, including packaging, thermal and mechanical design.
• Lead the transition of designs to high‑volume manufacturing, working closely with vendors, ODMs and internal teams.
• Apply and validate advanced packaging metrology; create custom test fixtures, perform data acquisition and root‑cause analysis.
• Use simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK to optimize packaging architectures for quality, performance and cost objectives.

• Master’s degree in mechanical engineering or equivalent.
• 5+ years of industry experience in advanced semiconductor packaging.
• 10+ years of mechanical design experience for semiconductor‑based systems.
• Direct experience designing and testing test vehicles for packaging architectures.
• Expertise in packaging architecture optimization.
• Experience working with packaging component vendors, ODMs and cross‑boundary teams.
• Proficiency with FEA/CFD simulation tools: ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK.

• Experience with advanced packaging metrologies, laboratory thermal/mechanical measurements, infrared thermography, acoustic chambers, and thermal test setups.
• Strong understanding of product development life cycles from concept to high‑volume manufacturing.
• Knowledge of heatsink solutions, thermal interface materials, liquid cooling technologies, and related components (fans, UQDs, manifolds, CDUs).
• Development of CFD and compact RC models for SoC and package thermal analysis, with correlation to experimental data.
• Ability to design, set up and execute lab experiments, perform design of experiments, and apply Six Sigma methodologies.
• Knowledge of hardware and software thermal / power management control algorithms.
• Validated thermal models through power/thermal measurements on hardware.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants:
Job duties for this position include work safely and cooperatively with other employees, adhere to standards of excellence, communicate effectively, and follow all applicable laws and company policies. Criminal history may be considered in relation to the material job duties listed above.

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