Senior Technical Lead, New Product Engineering, Power Discrete/Module
Listed on 2026-08-02
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Engineering
Quality Engineering, Product Engineer, Test Engineer
Power Discrete New Product Engineering Technical Leader (MTS)
We are searching for a Power Discrete New Product Engineering Technical Leader (MTS) to drive all product-level engineering activities for Si, SiC, and GaN discrete/module in automotive and industrial applications s is a high-priority business growth area for the division, and we invite you to join us in this exciting career opportunity.
ResponsibilitiesThe successful candidate will act as the single product-level engineering owner, ensuring alignment between technical execution and business objectives across global NPD teams and functions to achieve performance, reliability, cost, and schedule targets.
1. Product-Level Engineering Ownership
- Own product definitions and technical requirements for power discrete and power module products.
- Translate business, system, and customer requirements into clear, actionable product-level engineering deliverables.
- Ensure consistency of product intent across die, package, and module implementations.
- Own and manage product-level tradeoffs among performance, reliability, cost, manufacturability, and schedule.
- Identify and evaluate candidate module architectures, technologies, and packaging concepts for feasibility and risk.
2. Cross-Functional Development Coordination
- Act as the primary integration and alignment point between TD, PE, packaging, test, reliability, quality, supply chain, and manufacturing teams.
- Drive alignment on interfaces, dependencies, deliverables, and milestones across organizations.
- Review and provide technical oversight on module design, electrical-thermal analysis, structural simulation, and module design verification.
- Identify execution gaps, conflicts, and dependencies, and facilitate resolution through appropriate technical owners.
- Enable timely, decision-ready outcomes without directly owning detailed die or package design authority.
- Coordinate system-level electrical, thermal, and mechanical modeling to validate product performance.
3. Execution Governance & Risk Management
- Own and maintain product-level risk registers covering design, reliability, qualification, and manufacturing risks.
- Drive mitigation plans, track execution status, and ensure risk visibility at the program level.
- Lead product design reviews, execution checkpoints, and qualification readiness reviews.
- Ensure adherence to NPD governance, gate requirements, and engineering best known methods (BKMs).
4. Problem Solving, Escalation & Task Force Leadership
- Act as the product-level owner for complex technical and execution issues.
- Lead cross-functional task forces to address critical design, qualification, reliability, or yield challenges.
- Drive structured problem solving and root-cause analysis at the product level.
- Manage technical escalations by clearly framing issues, risks, options, and recommended paths forward for leadership decision-making.
5. Qualification, Reliability & Release Readiness
- Own product-level qualification strategy, ensuring alignment with automotive, industrial, and customer requirements.
- Coordinate with reliability, FA, and PE teams to assess qualification data and product-level impact.
- Ensure issues are properly dispositioned with clear containment, corrective actions, and documented learning.
- Drive incorporation of lessons learned into future programs and BKMs.
6. Executive Reporting & Stakeholder Communication
- Provide clear, concise executive-level reporting on product status, risks, qualification readiness, and recovery plans.
- Translate complex technical challenges into decision-ready summaries for leadership forums.
- Consolidate cross-functional inputs into aligned product-level messaging with clear accountability and timelines.
Master's degree in electrical engineering, Materials Science, or related field.
- 10+ years of experience in power semiconductor product development (power discrete and/or modules; Si-IGBT / SiC MOSFETs preferred).
- Strong understanding of module packaging, thermal management, interconnects, and reliability fundamentals.
- Understanding of Design CAD and simulation tools
- Proven ability to lead product-level execution without direct design authority.
- Strong cross-functional…
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