Sr. Mechanical Engineer - Avionics Mechanical Packaging - TeraWave

## Sr. Mechanical Engineer - Avionics Mechanical Packaging - Tera Wave Apply locations :
Greater Seattle Area:
Los Angeles, CA:
Denver, COtime type:
Full time posted on:
Posted Yesterday job requisition :
R65838

Application close date:

Applications will be accepted on an ongoing basis until the requisition is closed.

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!  Blue Origin is pioneering the future of space-based communications with Tera Wave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth.

This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

As part of the Spacecraft Bus Avionics team, you will be responsible for driving requirements, design, analysis, test, and critical review of avionics enclosures and assemblies which house electronic components. This senior level role requires leadership, expertise, and training for the mechanical team. You will play a key role in developing the Tera Wave Satellite system from concept through formal qualification and verification including integration and flight support activities.

** Special Mentions:
*** Relocation provided
* Travel not typically expected, but on an as-needed basis up to 15%
** Responsibilities include but are not limited to:
*** Provide leadership as a member of a cross disciplinary team in a fast-paced design environment
* Participate in the entire design cycle of flight and mission critical avionics
* Collaborate with customers and stakeholders to define requirements and design architecture
* Collaborate with the electrical engineering team to incorporate printed circuit board and interconnect systems, including thermal and structural analyses of these components
* Lead design trade studies
* Design avionics enclosure solutions for performance and high reliability in harsh environments
* Create mechanical interface definitions, specifications, and control documents
* Create 3D CAD models and assemblies, part and assembly drawings, installation drawings, and other required technical documentation
* Build and evaluate prototype assemblies
* Create assembly aids and test fixtures
* Collaborate on and document team mechanical best practices
* Plan and conduct engineering tests and data reviews
* Create and deliver presentations, proposals, and training material on technical subjects
* Review assembly instructions and support hardware builds
* Validate requirements through design, test, analysis, and inspection
* Support Production and Quality Engineering as needed, including dispositioning material defects
* Manage revisions of the product design configurations through the product lifecycle
* Mentor and train junior engineers
* Review and approve designs and documentation created by other team members
*
* Minimum Qualifications:

*** B.S. degree in mechanical or aerospace engineering
* 10+ years of recent experience designing ruggedized electronic enclosures or similar high-performance / high reliability hardware
* Skilled with static structural, modal, random vibration, and thermal analysis
* Skilled with 3D CAD modeling programs (Creo preferred)
* Skilled with FEA tools (Ansys preferred)
* Experience with Steinberg or Engelmeier solder fatigue
* Skilled with GD&T implementation and analysis (ASME Y14.5)
* Ability to be self-directed and balance several projects at one time
* History of communicating design concepts and analysis results effectively
* Experience with environmental testing including vibration, shock, thermal cycle
* Experience performing failure analysis and establishing root cause / corrective action
*
* Preferred Qualifications:

*** Experience with one or more of the following packaging disciplines: avionics, power regulators and distributors, batteries, optics, sensors, motor controllers, RF radios and amplifiers, displays, controls, antennas, and navigation instrumentation.
* Experience with aerospace, launch vehicle, or spacecraft avionics systems
* Experience with recent versions of Creo, Windchill, Ansys Mechanical
* Experience with fatigue analysis and fracture mechanics
* Experience with aerospace industry standard structural analysis methods (Bruhn, Marks’, Shigley, Steinberg, Roark’s)
* Experience with additional environmental testing including EMI/RFI, TVAC
* Experience training and mentoring junior level engineers
* Experience directing the activities of other engineers
* Hands-on, practical mechanical abilities
* History of demonstrating autonomous project leadership
* Technical authority has been recognized by the larger organization
* Flexibility and openness to…