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Senior ASIC Package Design Architect – FC‑BGA & MCM
Job in
Seattle, King County, Washington, 98127, USA
Listed on 2026-07-21
Listing for:
K2Spacecorporation
Full Time
position Listed on 2026-07-21
Job specializations:
-
Engineering
Systems Engineer, Hardware Engineer, Engineering Design & Technologists, Electronics Engineer
Job Description & How to Apply Below
K2
Space corporation in Seattle is seeking a Principal ASIC Package Design Engineer to lead the development of advanced ASIC packages. You will focus on flip-chip BGA and multi-chip module solutions, ensuring high-performance and reliability in designs.
This role requires over 10 years of experience in ASIC package design and a strong educational background in relevant engineering fields. Join a cutting-edge space startup and contribute to revolutionary satellite technology.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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