Software Project Engineer
Listed on 2026-07-10
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Software Development
Software Engineer
Company: Qualcomm Technologies, Inc.
Job Area: Engineering Group >
Software Engineering
Qualcomm & Microsoft Windows Co‑Engineering and Co‑Development Software Project Engineer should have deep knowledge of the Windows Operating System, Windows Kernel mode & User mode drivers development & debugging techniques, Board Support Package for QCT Compute chipsets (requirements, system architecture, HW—SW contracts, high-level SW design), breadth of expertise and collaborate with other internal & external engineering & business teams to execute smoothly under tight schedules to deliver successful results.
Primary responsibility is to technically drive BSP & OS features and bugs that require close collaboration and Co‑Development with Microsoft successfully and contribute to the success of Windows QCT Compute chipsets business.
- Collaborate with different Qualcomm & Microsoft technology teams, Product Managers, Customer Engineering, Technical Account Managers to identify features for next generation Windows compute chipsets and plan them through software development life cycle.
- Provide SW assessment of project scope, overall effort and risks.
- Collaborate & negotiate with different internal & external organizations on interdependencies, effort estimations, commitments and support alignment of different software features’ development and delivery schedules.
- Work with all relevant internal and external SW and non‑SW teams to ensure overall project plans, commitments and schedule are viable and signed off.
- Participate in product definition with PdMs, feeding SW requirements into product planning (RFP, RFQ).
- Lead ES/FC/CS planning.
- Participate in OEM feature planning activities.
Technically drive these selected complex features with internal & external dependencies through pre‑silicon development, integration and post‑silicon bring‑up, validation and deployment activities. Support Windows Hardware Compatibility Program Compliance / Windows Hardware Quality Labs / Hardware Lab Kit activities with IHV drivers’ certification focus. Bug management including telemetry reported issues that require close collaboration and co‑engineering with Microsoft and Qualcomm technology teams, collaboration tools development and maintenance.
Lead day‑to‑day Co‑Engineering features execution by running SW scrums, system level issue debug and resolution. Overall representative in project level forums representing SW team (core team meetings, exec reviews, architecture discussions, cross functional team planning), presenting status on different Co‑Engineering and Co‑development features development and critical software bugs’ resolution internally and externally. Drive lessons learned and continuously improve Co‑development and Co‑Engineering processes, tools and systems.
- Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Software Engineering or related work experience.
- Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Software Engineering or related work experience.
- PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Software Engineering or related work experience.
- 4+ years of work experience with programming languages such as C, C++, Java, Python, etc.
- 10+ years of work experience in Embedded SW for SoC, Windows HLOS and Windows Operating system.
- Wireless technologies (CDMA/WCDMA/LTE/5
GNR; WLAN; BT). - MM technologies:
Camera, Video, Audio, Display. - AI Technologies knowledge.
- Compute ecosystem knowledge.
- Power, performance and thermal system optimizations.
$ - $
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales‑incentive plans are not…
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