Failure Analysis Engineer - Power & Thermal

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We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

The Quality Engineering team is looking for an experienced Failure Analysis Engineer focused on Power and Thermal, with strong expertise in power behavior, thermal analysis, liquid‑cooling performance, failure isolation, and rail bring‑up. This individual will support customer and factory failure investigations for GPU accelerators, with primary ownership of PCB triage and board‑level fault isolation for power‑ and thermal‑related issues. They will review schematics and layouts to develop targeted debug strategies, set up scope measurements and diagnostics, run functional test DOE’s to reproduce and isolate failures, and work closely with design, validation, FW, and manufacturing teams to accelerate root cause analysis and corrective actions.

Your contributions will directly impact product quality, reliability, and customer satisfaction.

The ideal candidate is a hands‑on engineer with a strong hardware foundation and deep experience in power‑ and thermal‑related failure analysis, debug, and board bring‑up. They bring a strong analytical mindset and are skilled at triaging complex PCB failures by narrowing issues to the board, component, rail, thermal condition, cooling behavior, or system interaction level. They are comfortable reviewing schematics, setting up scope captures, running diagnostics, and designing functional test DOE’s to reproduce and isolate hard‑to‑find failures, while working effectively across design, validation, manufacturing, and repair teams.

A strong understanding of liquid‑cooling fundamentals—including flow rates, heat dissipation, and thermal transfer behavior—is important for this role. Their communication and documentation skills enable clear reporting and collaboration, and their curiosity and persistence help drive timely, high‑quality root cause analysis and corrective actions.

• Support internal and external requests to troubleshoot AMD GPU product failures with primary focus on Power and Thermal failure analysis, PCB triage, and board‑level failure isolation for continuous yield, quality, and customer support improvements.
• Develop and execute diagnostics, scope‑based measurements, and functional test DOE’s to reproduce, characterize, and isolate difficult board, power, and thermal‑related failures.
• Develop automation and tools to run tests and analyze results/logs.
• Perform structured PCB triage by narrowing failures to the board, component, power rail, layout interaction, or system integration level, and work with the contract manufacturer and internal AMD teams to reproduce failures, isolate root cause, and determine the most effective next steps for debug and corrective action.
• Use schematics, layout data, lab measurements, and power/thermal behavior knowledge to understand system behavior, trace likely fault paths, form debug hypotheses, and build targeted validation plans that drive efficient fault isolation and high‑quality failure analysis.
• Analyze liquid‑cooling performance and thermal dissipation behavior, including flow‑related conditions, heat transfer effectiveness, and cooling‑path anomalies, to support efficient root cause analysis of Power and Thermal failures.
• Document all findings into FA database and create a complete failure analysis report for customer consumption as needed.
• Present findings to key stakeholders, including senior management.
• Implement ongoing continuous improvements to the failure analysis process and techniques…