Sr Mechanical Engineer - Electronics Packaging

Description

Space is a critical domain, connecting our technologies, our security and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more — we can innovate, invest, inspire and integrate our capabilities to transform the future.

At Lockheed Martin Space, we aim to harness the full potential of space to cultivate innovation, reduce costs, and push the boundaries of what technology can achieve. We’re creating future‑ready solutions, focusing on resiliency and urgency through our 21st Century Security® vision. We’re erasing boundaries and forming partnerships across industries and around the world. We’re advancing spacecraft and the workforce to fuel the next generation.

And we’re reimagining how space can connect us, ensuring security and prosperity.

Join us in shaping a new era in space and find a career that's built for you.

• 3D CAD (Creo) design and drafting of mechanical/electro‑mechanical components and assemblies with a focus on design for reliability, manufacturing, and ruggedization.
• Perform engineering analyses: thermal, structural, tolerance stack‑ups.
• Design and conduct laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes.
• Collaborate across engineering disciplines to accomplish project tasks/objectives.
• Develop engineering qualification plans for requirements and workmanship verification.
• Identify technical risks and develop risk mitigation options with technical project team; present options/solutions to project management.

• Bachelor's degree in Mechanical Engineering or Electro‑Mechanical Engineering from an ABET accredited university.
• 8+ years experience in mechanical packaging of electronic components or systems.
• Experience designing for electronics manufacturing processes (e.g., SMT, PCB fabrication, polymeric application, applicable solder chemistries, etc.).
• Working knowledge of the electronics product development process.
• Basic working knowledge of GD&T.
• Experience working in schedule‑driven, multi‑disciplinary project teams.
• US citizenship and the ability to hold a US government clearance.

• Active TS/SCI security clearance.
• Master's degree with concentration in Electronics Packaging, Microelectronics, or Electronics Process Development.
• Experience designing for microelectronics manufacturing processes.
• Experience designing for space electronics packaging.
• Experience developing process maps, work instructions, and process documentation.

Security Clearance Requirement — This position requires a government security clearance; you must be a US citizen for consideration. Clearance level: TS/SCI.

Work Location — Onsite full‑time at a designated Lockheed Martin facility.

Pay Rate — The annual base salary range for this position varies by location and is generally $104,500 - $184,115.

Benefits offered — Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, Employee Assistance Program, Education Assistance, Parental Leave, Paid time off, and Holidays.

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

Experience Level: Experienced Professional

Business Unit: SPACE

Relocation Available: Possible

Career Area: Mechanical Engineering

Type: Full‑Time

Shift: First