Camera Engineer

Programmers.io is currently looking for a Camera Engineer

• Over 7 years of hands‑on experience in semiconductor IC or module packaging, especially on Camera Module or related processes.
• Process technology knowledge in SMT and advanced IC / camera module packaging areas.
• Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Alignment Process & etc.
• Experienced working with subcontract manufacturing partners.
• High volume manufacturing, and production ramp experience.
• Analysis/interpretation GR&R, Cp/Cpk and correlation analysis.
• Fluent in English communication, additional language skills a plus.
• Demonstrated ability to perform DOE, data analysis, SPC control.
• Demonstrated failure mode analysis, root cause investigation, and problem solving for product yield and quality issue.
• Project Management
  - Excellent data handling, documentation, critical milestone creation, and organization skill.
• Strong collaboration skill to work with diversified x-function team.

• Develop Camera Module assembly process / equipment / materials for FOL (Front of Line) and EOL (End of Line).
• Develop new assembly process / equipment / material for Camera module related components.
• Provide technical leadership in resolving any process issues.
• Responsible for developing DOEs, Statistical Process Analysis, Process Specification, D/PFMEA and Process control plan.
• Responsible for Failure analysis, Corrective actions and Yield improvement.

If you are interested, please apply or feel free to share your updated resume at anas.khan