Mechanical Packaging Engineer

Overview

Avicena is a privately held company developing micro

LED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products.

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This position involves developing and supporting mechanical designs for advanced packaging & optical components and systems. The mechanical engineer will collaborate closely with cross-functional engineering teams to capture product concepts, document component, and process flows, and perform analytical studies on material and packaging design that meets final product requirements.

• Design and develop advanced packaging solutions using CAD tools (primarily Solid Works), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines.
• Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution.
• Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness.
• Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability.
• Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs.
• Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations.
• Contribute to continuous improvement of engineering documentation, design standards, and development workflows.

• Bachelor’s degree in Mechanical Engineering, Materials Engineering, or a related field, with 3+ years of experience in semiconductor advanced packaging and design.
• Strong proficiency in Solid Works for 3D modeling and 2D drafting; experience with Solid Works Visualize or similar rendering tools preferred.
• Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA).
• Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus.
• Working knowledge of JEDEC and other relevant packaging standards.
• Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements.
• Proficient in Microsoft Office tools for documentation, reporting, and presentations.
• Excellent communication, documentation, and cross-functional collaboration skills.
• Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment.
• Strong analytical thinking and problem-solving skills.