Test and Reliability Leader

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next‑generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit (Use the "Apply for this Job" box below)..ai

If you’re excited about building impactful technology in a dynamic, hands‑on environment, we’d love to hear from you!

We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field.

• Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive Cp, Cpk improvement.
• Support the device packaging R&D and NPI with mechanical design, drawing and thermal modeling.
• Support device testing automation and data analysis automation/scripts or software development and implementation.
• Work with R&D to understand the device specs, particularly mechanical control outline, and assembly requirements and negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.
• Work with OSATs to support NPI and volume production contract manufacture with technical SOW drafting.
• Act as the technical project manager for owned projects.
• Provide DFM, DFR, and DFT inputs for HQ R&D teams for device packaging and assembly.
• Keep proper documentation, and initiate ECN and PCN when needed.
• Develop and track packaging and assembly component specifications as well as inventory.
• Audit/regularly visit our contract manufacturers and suppliers then provide reports.
• Write technical reports and present results to internal and external stakeholders.
• Build and grow the Operation Process Team worldwide.

• Have a mechanical engineer degree with relevant experience on optical module and/or Lidar assembly.
• Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.
• Experience or knowledge of optical sensors, optical device packaging process, or optical module assembly process.
• Experience with assembly process integration for process flow design and continuous process improvement.
• Expertise in mechanical drawings using Solid Works, mechanical simulation, and thermal simulation.
• Project management capability/experience is a must.
• Experience working with foundries, OSATs, assembly houses, PCBA fab, and contract manufacturers in process development and yield improvement is important.
• The ability to work independently and take ownership of projects as well as collaboratively in cross‑functional teams is a must.
• A fast learner is a must.
• Good work ethics is a must.
• Capable of keeping company confidential information and IP is a must.

• Knowledge or work experience with PCBA is highly desirable.
• Former experience of microelectronic and optical devices packaging is desired.
• Understanding Silicon Photonics is a plus.
• Experience with FMEA, failure analysis, and 8D report is highly desired.
• Supplier quality management experience is a plus.
• Knowledge of Lidar and relevant technologies is a plus.
• Former experience of writing technical SOW is a plus.
• Familiar with ECN, PCN, and documentation is highly desirable.

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time‑off policy
• Collaborative, fast‑paced, and inclusive work environment
• Opportunity to work on cutting‑edge technologies with a highly cross‑functional team

150, USD per year (Bay Area, CA)