Manufacturing Engineer
Listed on 2026-06-03
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Engineering
Manufacturing Engineer, Process Engineer, Electrical Engineering, Materials Engineer
Overview
We are seeking a highly motivated and technically skilled engineer to join the team bringing-up and qualifying a new Indium Phosphide (InP) photonics semiconductor fabrication facility. As a Process Development Engineer, you will be a senior individual contributor within Nokia’s Optical Components organization, participating in the development, optimization, and transfer of key process technologies that will enable advanced high-volume manufacturing of InP photonic integrated circuits (PICs).
This role requires technical expertise across semiconductor wafer fabrication methods and related device processing technologies, working closely with fellow engineers and internal stakeholders to enable efficient, high-yield integration of manufacturing processes.
Responsibilities- Process Development & Integration:
Develop and optimize wafer fab process modules (etch, deposition, lithography, metallization, etc.) for InP-based PICs and lasers, ensuring process robustness and repeatability. Develop fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints. Contribute to continuous improvement of tools, methods, and best practices. - Manufacturing Data & Yield Excellence:
Analyze and interpret data from device and process metrology collected in a manufacturing environment. Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to evaluate and improve process performance. - Technical Leadership:
Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp. Act as a technical interface with external or remote fabrication facilities and potential equipment vendors, ensuring alignment on process requirements and priorities. Lead and contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues.
- BS/MS or PhD (preferred) in Electrical Engineering, Materials Science, or related field. Minimum of 3 years of experience developing and manufacturing compound semiconductor materials, devices and processes.
- Process design and development for compound semiconductor devices based on III-V materials is highly desirable.
- Metal, semiconductor, and dielectric deposition and etching tools, chemistries, and methods.
- FMEA, SPC, process capability, and metrology.
- Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.
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Recruitment and BenefitsOur recruitment process:
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity. The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates.
Discover more about the recruitment process at Nokia.
Benefits (US):
Corporate Retirement Savings Plan, Health and dental benefits, Short-term and long-term disability, Life insurance and AD&D (company paid 2x base pay), Optional life and AD&D insurance, Paid time off for holidays and vacation, Employee Stock Purchase Plan, Tuition Assistance Plan, Adoption assistance, Employee Assistance Program/Work Life Resource Program. The above benefits exclude students.
Disclaimer for US/Canada:
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