Semiconductor Operations - SiP Productization

Semiconductor Operations - SiP Productization

Sunnyvale, California, United States Operations and Supply Chain

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The Apple Semiconductor Operations team is looking for a motivated, highly technical Component SiP productization engineering focusing on product and process development, supplier readiness, and high-volume manufacturing quality. This role will drive NPI execution, process bring‑up, qualification readiness, and quality improvement for advanced SiP, RF, antenna, mmWave, wireless, and high‑density module technologies. The successful candidate will work with module integration suppliers, OSATs, sub‑component vendors, PCB/substrate suppliers, and system integration sites.

They will interface regularly with Engineering, Operations, Reliability, and Quality teams.

• Deliver high‑density and high‑performance SiP/module technologies within thermo‑mechanical, performance, reliability, quality, cost, and form‑factor constraints.
• Support Advance Component SiP and system integration development for future products, including design rules, process bring‑up, materials/process selection.
• Drive quality readiness at vendor factories for development builds, risk ramp, and mass production.
• Lead supplier readiness across NPI phases, including process BKM lock, build‑exit criteria, factory audits, qualification status, and ramp‑risk closure.
• Resolve process, yield, reliability, and quality issues in product and manufacturing processes.
• Use data analysis and failure analysis to identify gaps in component design, package architecture, process capability, inspection coverage, and test readiness.
• Work with vendors and OEM/system integration sites to ensure compliance to Apple specifications and manufacturing requirements.
• Ensure qualification and reliability activities at suppliers are in line with product and process requirements.
• Partner closely with component design, hardware engineering, reliability, PD FEA/simulation, operations, and quality teams.
• Provide routine status reporting to leadership and elevate technical, quality, and supplier execution issues when needed.

• Strong SiP, semiconductor packaging, module assembly, or advanced packaging experience, including knowledge of assembly processes, materials, substrates, and package‑level failure mechanisms.
• 5+ years relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high‑volume manufacturing.
• MS/BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related technical discipline.
• Understanding of SPC, DOE, FMEA, JMP or equivalent data analysis tools, and factory quality metrics used to monitor production performance.
• Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board‑level reliability, MSL, bHAST, CAF, warpage, solder fatigue, and substrate/material interactions.
• Strong interpersonal skills to work with design, development, operations, reliability, quality, supplier engineering, and other cross‑functional teams.

• Hands‑on experience with supplier manufacturing process control, quality systems, factory audits, and production readiness reviews.
• Ability to take advanced packages or modules from concept and development builds to high‑volume manufacturing.
• Experience with RF, mmWave, antenna module, wireless module, high‑density package, or advanced SiP architecture is a plus.
• Ability to communicate technical risk clearly, drive issue closure, and provide concise executive‑level updates.
• Self‑mot…