Executive Director of R&D Engineering DIC-Advance Packaging

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You are a seasoned semiconductor leader with deep expertise in IC design and advanced packaging, including 3

DIC technologies. You have successfully led complex, cross‑functional organizations and delivered differentiated silicon IP solutions from concept to execution.

You bring a strong strategic mindset, combining technical depth with a clear understanding of market dynamics and customer needs. You are known for translating complex technical challenges into actionable plans and for influencing across engineering, product, go‑to‑market, and customer‑facing teams in a highly matrixed, global environment.

You inspire, develop, and empower high‑performing teams. You foster a culture of collaboration, accountability, and continuous improvement, and you lead with credibility, clarity, and purpose to consistently exceed business and customer expectations.

• Leading 3
  
  DIC silicon IP and advanced packaging design and verification across layout, physical design, signal integrity, power integrity, thermal modelling management, and mechanical integrity for AI infrastructure and high‑performance computing products.
• Managing cross-functional collaboration with EDA tool development, Go‑To‑Market strategies, and Customer Success in utilizing Synopsys solutions.
• Keeping track of industry trends in the fast-changing field of 3
  
  DIC and semiconductor packaging to drive new product innovations.
• Ensuring developed solutions are in alignment with business objectives while delivering differentiated technical solutions.
• Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.

• Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.

• Driving the strategic technology development, planning, and execution of Silicon IP for 3
  
  DIC and advanced packaging solutions.
• Influencing and shaping the direction of Synopsys’ product offerings in the semiconductor industry.
• Playing a key role in advancing Synopsys’ 3
  
  DIC and advanced packaging leadership by contributing to the company long‑term technology roadmap.
• Enhancing customer satisfaction by delivering state‑of‑the‑art solutions that meet their needs.
• Contributing to the overall success and growth of Synopsys by leading high‑impact projects.
• Fostering a culture of excellence and continuous improvement within your team.

B.S./M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience.

• 15+ years of experience in the semiconductor industry, with demonstrated depth in advanced packaging and 3
  
  DIC technologies.

• Deep hands‑on and organizational expertise in 3
  
  DIC architectures, including chiplets, heterogeneous integration, and die‑to‑die interconnects.
• Strong command of 3
  
  DIC‑specific design and signoff challenges, including signal and power integrity, thermal behavior, mechanical stress, reliability, and yield.
• Experience building, leading, and scaling large, multi‑site engineering teams, delivering complex 3
  
  DIC technologies from architecture through production.
• Ability to drive end‑to‑end silicon IP execution, making sound tradeoffs across performance, power, area, cost, and manufacturability.
• Capability to define technical vision and long‑term roadmap for 3
  
  DIC and advanced packaging, aligned with business strategy.
• Effectiveness in influencing across functions, partnering with EDA, product management, go‑to‑market, manufacturing, and customer success teams in a matrixed environment.
• Strong customer‑facing leadership, including direct engagement with leading customers and ecosystem partners to shape requirements and drive adoption.
• A customer‑centric mindset, strong execution discipline, and commitment to innovation and continuous improvement.