Test and Reliability Leader

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next‑generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit (Use the "Apply for this Job" box below)..ai

• We areseekingan experienced process lead engineer in the field of optical device packaging and assembly withadegree in Mechanical Engineering, Physics or a related field.

• Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive
  
  Cp,Cpkimprovement.
• Support the device packaging
  
  RnDand NPI with mechanical design, drawing and thermal modelling.
• Support devicetestingautomation and data analysis automation/scripts or software development and implementation.
• Work with
  
  RnDto understand the device specs, particularly mechanical control outline, and assembly requirements and negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.
• Work withOSATs tosupport NPI and volume production contract manufacture with technical SOW drafting.
• Act as the technical project manager for owned projects.
• Provide DFM, DFR, and DFTinputs for HQRnDteams for device packaging and assembly.
• Keep proper documentation, and initiateECN andPCN when needed.
• Develop andtrackpackaging andassemblycomponentspecificationsas well as inventory.
• Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
• Writetechnical reports and present results to internal and external stakeholders.
• Build and grow the Operation Process Team worldwide.

• Havea mechanicalengineerdegree with relevant experienceonoptical module and/or Lider assembly.
• Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.
• Experience or knowledge of opticalsensors. optical device packaging process, or optical module assembly process.
• Experience with assembly process integration for process flow design and continue process improvement.
• Expertisemechanical drawings using
  
  Solid
  
  Work, mechanical simulation, and thermal simulation.
• Project management capability/experience isa must.
• Experience working with foundries, OSATs, assemblyhouses, PCBAfab, and contract manufacturers in process development and yield improvement is important.
• The abilityto work independently and take ownership of projects as well as collaboratively in cross‑functional teamsis a must.
• A fast learner isa must.
• Good work ethics isa must
• Capableofkeeping company confidential information and IP is a must.

• Knowledge or work experience withPCBAis highly desirable.
• Former experience of microelectronic and optical devices packaging isdesired.
• Understanding Silicon Photonics is a plus.
• Experience with FMEA, failure analysis, and 8D report is highly desired.
• Supplier quality management experience is a plus.
• Knowledge of Lidar and relevant technologies is a plus.
• Former experience of writing technical SoW is a plus.
• Familiar with ECN,PCN,and documentationishighly desirable.

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work oncutting-edge technologies with a highly cross‑functional team