Lithography Process Engineer

Ifyou’reexcited by innovation, impact, and contributing meaningful workto something truly transformative, this role is for you.

Come buildwhat’snext with us.

In this role,you’llhelpdrivelithographyprocess development and materialevaluationforleading edgetechnologiesandleverageyourexpertiseto improve existing processes.

Your work will enable breakthroughs across various applications, including advanced packaging—pushingon‑package performance to approach on‑chip integration—and unlockon‑wafer stitching of die to overcome reticle and yield limits in conventional flows.

Multibeam Corporation is a leading high productivity electron-beam technology innovator in waferfabequipment. Our technology will revolutionize the industry with maskless, full-wafer patterning capabilities. Our multi-column direct write system pushes what is possible by enabling rapid prototyping to volume production with maskless lithography flexibility.

We believe the key to our successareour people. Our best employees love what they do and bring unique backgrounds to our fast-paced, highly collaborative environment. We are managed by some of the brightest in Silicon Valley, including Dr. David K. Lam, founder and prior CEO of Lam Research. The ideal candidate is independent, flexible, and enjoys working in a fast-paced and creative technical environment.

• Own hands-on lithography from resist spin to develop and metrology, turning experiments into stable process
• Plan and run smart DoE campaigns that separate signal from noise and accelerate learning
• Triage and resolve issues across hardware, process, and metrology—fast
• Partner with cross-functional teams (process, applications, systems, product) to move from demo to production

• Hands-on lithography experience (photo or e-beam), from tool setup to recipe
• Strong resist processing fundamentals (materials, bake/develop windows, lineedge/linewidth control)
• Proven lithography process troubleshooting skills (root cause, containment, corrective actions)
• Experiment planning / DoE skills and adata‑driven approach to decisions

• Help build and scale groundbreaking, first-of-its-kind technology that’sredefining the industry
• Enable the emergence of new microfabrication segments, such asquantum computing, next generation advanced packaging and high-speedphotonics
• Support the development of packaging technologies that bridge the gap between on-chip performance and overalldeviceperformance
• Advance on-wafer stitching of die to break past reticle and traditional yield constraints
• Enable novel quantum and photonics solutions
• Ship real capability—measurable performance and productivity with real world impact