ATE Test Engineer , Amazon Leo

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

As an ATE Test Engineer, you will engage with an experienced cross-disciplinary staff to conceive, design, and develop innovative test solutions for products developed for and deployed in Amazon Leo phased array antennas in LEO satellites and ground terminal products. You'll be a key contributor to defining and developing characterization and validation ATE test methodology for Amazon Leo custom silicon, helping take devices from silicon bring-up through release to high-volume production.

You will contribute across digital, high-speed I/O, and RF test, and support the design and verification of the ATE hardware that enables it. You must be responsive, flexible, and able to succeed within an open, collaborative peer environment.

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

• Design, review, and verify ATE hardware (load board, socket, and probe card) for signal and power integrity, with attention to high-speed and RF interfaces, collaborating with external vendors through the hardware design and build process.
• Implement and optimize test programs for mm-wave System-on-Chips (SoCs) on ATE platforms such as Teradyne/Advantest and ensure seamless integration into high-volume manufacturing environments.
• Implement and optimize RF, mixed-signal, and high-speed interface test routines for high-volume manufacturing.
• Implement on-chip calibration techniques for analog and mixed-signal circuits and validation of calibration accuracy across process/voltage/temperature (PVT) corners.
• Partner directly with DFT teams to define test insertion strategy, review pattern quality, resolve coverage gaps, and optimize scan/MBIST/BIST content for ATE execution.
• Drive test program release to production, ensuring test readiness, quality, and yield targets are met at hand-off to high-volume manufacturing.
• Optimize test time, yield, and repeatability across process, voltage, and temperature.
• Support RMA and field-return debug, using test and characterization data to root-cause and resolve downstream quality issues.

• Bachelor's degree in Electrical Engineering or a related field
• 4+ years of experience in ATE test engineering, preferably in high-volume manufacturing of communication/modem processors or consumer SoCs.
• Experience developing and debugging test programs on Teradyne UltraFLEX and/or Advantest platforms.
• Experience with digital, high-speed I/O, and RF ATE test.
• Experience with ATE hardware (load board, socket, or probe card) design and verification.
• Strong written and verbal communication skills.
• International travel required during release-to-production phases.

• Master's degree in Electrical or Communications Engineering or a related field
• Experience testing digital modem, baseband, or communication processor SoCs on ATE.
• Knowledge of transceiver architecture and topology, with a strong understanding of key test parameters and performance metrics.
• Experience with semiconductor wafer sort testing, including RF probe-level challenges and associated test methodologies.
• Digital test techniques such as scan, ATPG, MBIST, and loopback; JTAG and IEEE 1149.x.
• ATE hardware design and verification, including signal/power integrity analysis for high-speed and RF interfaces, and working with vendors through the hardware design and build…