Holefill Process Engineer

Process Engineer – Printed Circuit Boards

TTM Technologies, Inc., a leading global manufacturer of printed circuit boards, seeks a Process Engineer to manage manufacturing processes, root‑cause analysis, equipment programming, and safety compliance for specialty PCB production.

• Interface with departments to maintain, analyse, and improve processes, production and controlled documentation.
• Qualify new processes internally and externally.
• Conduct root‑cause analysis of day‑to‑day issues across departments.
• Evaluate equipment through DOE and capability testing.
• Program, troubleshoot and maintain equipment software.
• Provide technical and analytical support to customers and suppliers concerning product and chemical processes.
• Communicate procedural changes and safety hazards to supervisors and managers.
• Manage hazardous waste handling, accident reporting, and safety training.
• Participate in safety training and comply with JSA, PPE, MSDS and all safety procedures.
• Utilise project management skills to structure plans and execute tasks efficiently.

• Bachelor’s degree in Chemical, Electrical, or Mechanical Engineering.
• 1‑4 years of experience as a Process Engineer, with at least 1 year in a PCB fabrication environment preferred.
• Strong knowledge of manufacturing processes, process control and root‑cause analysis.
• Hands‑on analytical approach to process and mechanical problems.
• Good written and verbal communication skills.
• Ability to work under pressure and make quick decisions.
• Subject‑matter expertise in the area of responsibility and ability to work on medium‑complex assignments.
• ITAR compliance: U.S. citizenship or permanent residency required.
• Physical capability to lift 45lb., walk, stand for up to 8hours, and work shift/ weekend flexibility.

• Full‑time, onsite at 6457 Fly Rd., East Syracuse, NY 13057.
• Occasional travel (