Module Integration Engineer

Position Summary

Seeking a senior individual contributor with hands‑on experience in module process integration for advanced Gate‑All‑Around (GAA) technologies. The Module Integration Engineering (MIE) team drives new technology transfer, establishes process integration routes, and enhances process margin, performance, yield, and reliability. In this role you will perform 2nm GAA source & drain (SD) module integration projects, working closely with Process Architect, Process Integration Engineering, Fab Engineering units, Device & SRAM integration, DFM, and manufacturing teams.

• Execute the Front End of Line (FEOL) module setup plan—particularly the source & drain (SD) module—with minimal supervision to meet aggressive qualification timelines.
• Monitor line performance, intervene on off‑target SPC excursions, and develop improvement plans that satisfy process capabilities.
• Lead engineering projects that drive high‑volume manufacturing (HVM) product qualification, yield ramp‑up, and performance target achievement.
• Lead Task Force Teams (TFTs) to resolve systematic yield, performance, or reliability challenges.
• Perform feasibility studies and create design of experiments (DOE) for performance and yield improvement throughout the product development cycle.
• Produce written reports and deliver oral presentations for internal management and external partners.

• Master’s or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field.
• Minimum 8 years of experience on advanced node FinFET or GAA technology.
• Front End of Line (FEOL) module process integration engineering experience.
• Strong preference for GAA source & drain module integration engineering experience.
• Device physics knowledge with hands‑on work in FinFET or GAA devices.
• Knowledge of unit processes such as lithography, dry/wet etch, CMP, diffusion, implant, thin‑film deposition, and metrology.
• Expertise in Design of Experiments (DOE) and experience with data‑analysis software (e.g., JMP, Spotfire).
• Experience leading projects and/or serving as a Task Force Team (TFT) lead.
• Ability to shift focus, change priorities, and meet deadlines on multiple priorities.
• Interpersonal skills with the ability to influence, motivate, and align diverse stakeholders.
• Excellent written and verbal communication skills.
• Willing to work and learn in a fast‑paced, cross‑functional, multicultural team environment.

All positions at Samsung Austin Semiconductor require you to be onsite.

Base salary range: $106,000 - $206,000. Total compensation may include a competitive benefits package and participation in incentive compensation programs based on performance.

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives

Samsung Electronics America, Inc. and its subsidiaries are committed to employing a diverse workforce and provide Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, protected veteran status, genetic information, disability status, or any other characteristic protected by law.